{"product_id":"baku-ba-5052-bga-solder-paste-for-mobile-phone-repair-35g-tin-35-45-microns-138-celsius-melting-point","title":"BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point","description":"\u003cbr\u003e1. Lead-free Solder Paste is a high-performance, no-clean soldering solution designed for precision electronics assembly and repair. Ideal for BGA applications, it delivers exceptional conductivity, reliability, and efficiency while minimizing post-weld residue.\u003cbr\u003e2. Strong Adhesion \u0026amp; Extensibility: Provides robust attachment to solder joints and retains flexibility after cooling, ensuring long-term durability.\u003cbr\u003e3. Advanced Membrane Removal Technology: Reduces net scraping frequency during operation, improving workflow efficiency by up to 30%.\u003cbr\u003e4. No-Clean \u0026amp; Eco-Friendly Formula: Leaves very little residue, eliminating post-weld cleaning. High resistance ensures stability in demanding conditions.\u003cbr\u003e5. Particle Size: 35-45 microns\u003cbr\u003e6. Melting Point: 138 degrees Celsius\u003cbr\u003e7. Recommended Temperature: 160–170 degrees Celsius\u003cbr\u003e8. Net Weight: 35g\u003cbr\u003e\u003cbr\u003e","brand":"Sunsky","offers":[{"title":"Default Title","offer_id":50751767904557,"sku":"TBD06060300","price":4.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0754\/4379\/8317\/files\/TBD06060300.jpg?v=1748224019","url":"https:\/\/www.megadiscountstore.shop\/products\/baku-ba-5052-bga-solder-paste-for-mobile-phone-repair-35g-tin-35-45-microns-138-celsius-melting-point","provider":"Mega Discount Store ","version":"1.0","type":"link"}